FORMAPad® Dispensable Gap Pads

FORMAPad®

Dispensable Gap Pads

FORMAPad® combines the best features of a high-performance Thermal Grease and those of Silicone Thermal Pads.

FORMAPad® is available as mono and bi-component products, which are applied in the same way that a liquid adhesive or a thermal grease, filling perfectly even the most uneven surfaces.

After cure, FORMAPad® gets the consistency of a soft and flexible elastomer (like a "pad") which guarantees that it will not dry out, migrate or bleed, delivering reliability and long lifespan for your application.

Features

Ultra low hardness module, which guarantees that there will not be any damage caused by superficial pressure to your board components during assembly
Ultra conformation even to more complex and intricate geometries of your application
Single solution for multiple applications: can suit the conditions of thickness and dimensions of your entire product line
Good production efficiency, because material is supplied in 300cc cartridges with mixer nozzle attached, which guarantees zero loss
Possibility of customization of the degree of fluidity (viscosity) to suit your production process

Options

30cc Syringes, 1 Kg Jar, 6 oz. Semco & 300cc cartridges, 1 gallon & 5 gallon pails

Benefits

Excellent mechanical and chemical stability
Ready for module rework
High absorption of mechanical stress and vibration during and after assembly
No migration, no drying, no oil bleeding
Curing at ambient temperature, but can also be accelered with heat cure

Aplicações

LEDs
Smartphones
Tablets
Laptops
ECU

Part Number	Formulation	Thermal Conductivity W/m.k	Working temperature in °F	Thermal Resistance in° ² C.in/W	Data Sheet

FP GI-5100	Mono-componente	2,6	(-55 a 255)	0,01