COOLPad®
Silicon Thermal PADs

COOLPad has been developed in order to meet the increasing demands of the electrical, electronic and automotive industries for materials with higher thermal performance and ease of assembly line application.

Features

  • Low hardness and high compressibility
  • Possibility of adding special elements to increase thermal conductivity
  • High degree of conformation even to uneven surfaces
  • Acts as thermal insulator
  • Can be supplied with adhesive on one or both sides
  • Wide range of thicknesses and degrees of hardness
  • Can be supplied as die-cut parts
  • Wide range of degrees of thermal conductivity

Options

  • Available with or without adhesive
  • Possibility of mechanical fiberglass reinforcement
  • Available in thicknesses from 0,10 to 10,0mm
  • Available in rolls, sheets or pieces already cut to size
  • Custom thickness according to customer's specification

Benefits

  • Eliminates the air gaps between the PCI and the heatsink, ensuring low resistance to heat flow
  • Absorbs vibrations and impacts
  • Extremely simple and quick application
  • Tear and puncture/drilling resistance
  • Compatible with automatic application devices

Applications

  • Between semiconductors and heatsinks
  • COB LED
  • Hard Drives
  • IGBT Modules
  • Signal amplifiers
  • Electrical Sources
  • Drivers
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